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1 thermal oxidation
термічне [високотемпературне] оксидуванняEnglish-Ukrainian dictionary of microelectronics > thermal oxidation
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2 oxidation
оксидування, окислення - catalytic oxidation
- controlled oxidation
- dry oxidation
- electrolytic oxidation
- field oxidation
- gate oxidation
- heat oxidation
- high-pressure oxidation
- interlevel oxidation
- laser-induced oxidation
- lateral oxidation
- low-temperature oxidation
- open-tube oxidation
- planar oxidation
- plasma oxidation
- selective oxidation
- self-terminating oxidation
- steam oxidation
- surface-wide oxidation
- thermal oxidation
- ultra-violet laser oxidation
- wet oxidationEnglish-Ukrainian dictionary of microelectronics > oxidation
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3 process
1. ім.1) процес; (технологічний) метод, спосіб2) технологія (див. т-ж technique, technology)3) (технологічна) обробка; технологічна операція2. дієсл. обробляти; проводити технологічну операцію - all-ion-implant process
- all-planar process
- Auger process
- batch process
- BH bias and hardness process
- BH process
- bonding process
- BOX process
- bulk CMOS process
- bumping process
- chip-on-board process
- closed CMOS process
- CMOS-on-sapphire process
- composite сеll logic process
- contact process
- conventional process
- deep охide isolation process
- DIFET process
- diffused eutectic aluminum process
- direct synthesis and crystal pull process
- double-diffused process
- double ion-implanted process
- double-layer polysilicon gate MOS process
- double-layer polysilicon gate process
- epitaxial deposition process
- epitaxial process
- epitaxial growth process
- flip-over process
- floating-gate silicon process
- front-end process
- gold-doped process
- guard-banded CMOS process
- heterogeneous process
- high-voltage process
- HMOS process
- imaging process
- implantation process
- in-house process
- interconnection process
- inverted meniscus process
- ion plating process
- isoplanar -S, -Z, -2 process
- isoplanar process
- junction-isolated process
- laser-recrystallized process
- lithographic process
- low-pressure process
- low VT process
- lost wafer process
- major process
- masking process
- master slice process
- mesa-isolation process
- metal-gate MOS process
- metal-gate process
- microbipolar LSI process
- micrometer-dimension process
- mid-film process
- Minimod process
- Mo-gate MOS process
- Mo-gate process
- nitride process
- nitrideless process
- NSA process
- oxide-film isolation process
- oxide isolated process
- oxygen refilling process
- patterning process
- phosphorous buried-emitter process
- photoablative process
- photolithography process
- photoresist process
- planar oxidation process
- Planox process
- plasma etch process
- Poly I process
- Poly II process
- Poly 5 process
- poly-oxide process
- Poly-Si process
- polysilicon-gate process
- poly-squared MOS process
- proprietary process
- PSA bipolar process
- PSA process
- refractory metal MOS process
- refractory metal process
- sacrificial охide process
- sapphire dielectric isolation process
- scaled Poly 5 process
- screen-and-fire process
- selective field-охidation process
- self-aligned gate process
- self-aligned process
- self-registered gate process
- self-registered process
- semi-additive process
- semiconductor-thermoplastic-dielectric process
- semicustom process
- shadow masking process
- silk-screen process
- single poly process
- SMOS process
- SOS/CMOS process
- stacked fuse bipolar process
- Stalicide process
- step-and-repeat process
- subtractive-fabrication process
- surface process
- Telemos process
- thermal process
- thermally асtivated surface process
- thermal-охidation process
- three-mask process
- triple-diffused process
- triply-poly process
- twin-tub process
- twin-well process
- V-groove MOS process
- V-groove process
- wet process
- 3-D process -
4 enhancement
1) збагачення 2) підсилення; стимулювання; стимуляція - electron enhancement
- hole enhancement
- image enhancement
- ion enhancement
- irradiation induced enhancement
- oxidation enhancement
- picture enhancement
- resolution enhancement
- thermal-gradient enhancementEnglish-Ukrainian dictionary of microelectronics > enhancement
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5 layer
1. ім. шар; плівка 2. дієсл. наносити шар - accumulation layer
- amorphized layer
- anti-oxidation layer
- barrier layer
- base layer
- blanket layer
- blocking layer
- boundary layer
- branch layer
- buffer layer
- buried layer
- cap layer
- composite layer
- conducting layer
- conductor layer
- contact layer
- continuous layer
- depletion layer
- deposited layer
- diffused [diffusion] layer
- diffusion-impervious layer
- diffusion-source layer
- doped layer
- driving layer
- epitaxial layer
- epi layer
- etch-resistant layer
- evaporated layer
- evaporation layer
- field oxide layer
- Gaussian-doped layer
- heteroepitaxial layer
- high-concentration layer
- high-mobility layer
- homoepitaxial layer
- host layer
- implantation layer
- implanted layer
- impurity layer
- inert layer
- injection layer
- injector layer
- inset oxide layer
- insulating layer
- insulation layer
- insulator layer
- interconnection layer
- interface layer
- interfacial layer
- interlayer dielectric film layer
- intrinsic layer
- inversion layer
- ion-implantation layer
- lacquer layer
- lightly doped layer
- liquid-phase epitaxial layer
- low-mobility layer
- masking layer
- metallizationlayer
- metallayer
- metallized layer
- molecular epitaxy layer
- monoatomic layer
- monomolecular layer
- multiple layer
- multiple wiring layers
- n layer
- native layer
- nucleating layer
- ohmic layer
- organic passivation layer
- oxide-inhibiting layer
- p layer
- passivating layer
- passivation layer
- photosensitive layer
- planarizing layer
- polysilicon layer
- protective layer
- pyrolytically deposited layer
- registered layers
- resistive layer
- sacrificial layer
- sandwiched layers
- sealing layer
- seal layer
- separation layer
- signal layer
- source layer
- space-charge layer
- stepped layers
- stopping layer
- substrate layer
- superconductive layer
- superimposed layers
- superlattice layer
- supported semiconductor layer
- thermal-охide layer
- transition layer
- vacuum-deposited layer
- vacuum-evaporated layer
- via layer
- wiring layer
- wiring channel layer
- δ-doping layer -
6 system
1) система 2) устаткування; пристрій - assembly system
- autolayout system
- automated accounting system
- automated photomasking system
- automated photomask system
- automatic data асquisition system
- automatic data analysis system
- automatic data digitizing system
- base-metal system
- batch system
- bi-etching system
- bubble test system
- building-block layout system
- CAD system
- cassette-to-cassette system
- chopping system
- closed-tube oxidation-diffusion system
- code-translation data system
- command retrieval system
- computer-aided design system
- conductor paste system
- conductor system
- continuous stage motion e-beam system
- Czochralski production system
- damage tolerant system
- data асquisition and display system
- data analysis and reduction system
- data collection and processing system
- decision data support system
- decision-support system
- deep-UV projection system
- design automation system
- die attach system
- dielectric paste system
- dielectric system
- diffusion system
- direct step-on-wafer system
- direct-write e-beam system
- dopant system
- double-chamber vacuum-deposition system
- double-track system
- electron-beam mask system
- electron-beam projection system
- encapsulation welding system
- epitaxial growth system
- epitaxial system
- epoxy dispensing system
- etchant regeneration system
- etching system
- etch/strip system
- evaporation system
- exposure system
- fabrication system
- fault-tolerant system
- flex-fab system
- flexible machining system
- fly’s eye system
- gate-array layout system
- Gaussian-beam e-beam system
- Genesil system
- graphite furnace atomic absorption system
- hierarchically CAD system
- hierarchical-oriented CAD system
- high-resolution electron-beam system
- IC system
- image projection system
- indexing system
- ink system
- in-line system
- integrated programmable gate-array system
- ion-beam system
- ion-beam sputtering system
- isoplanar system
- laminar-flow system
- lead-forming system
- lead-frame assembly system
- lithographic system
- lithography system
- logic analysis system
- logic synthesis system
- mask alignment and exposure system
- metal system
- metallization system
- Micralign system
- micro-Optical Electro-Mechanical systems MOEMS
- micro-Optical Electro-Mechanical systems
- micropower system
- multichip system
- multicircuit microprocessor system
- multidomain system
- multiple-tens camera system
- negative-resist system
- non-real-time data automation system
- one-step t-fault diagnosable system
- one-to-one scanning system
- on-line circuit analysis system
- on-line circuit design system
- open-ended CAD system
- open-tube system
- palladium-silver thick-film conductor system
- palladium-silver conductor system
- paste system
- photomasking system
- photorepeating system
- pick-and-place system
- planar plasma system
- plenum flush system
- portable CAD system
- positive resist system
- preinsertion processing system
- printed-circuit board assembly system
- printed-circuit assembly system
- probing system
- processing system
- production system
- projection printing system
- projection system
- quick vacuum system
- reduced system
- reducing electron -beam projection system
- reducing electron projection system
- reflow soldering system
- rinser/dryer system
- screen printing system
- scribing system
- self-documenting CAD system
- self-repair system
- sequentially t-fault diagnosable system
- shaped-beam e-beam system
- single-chip system
- SMIF system
- software test-bed system
- solder evacuation system
- solder fusion system
- split-chamber vacuum coating system
- split-field alignment system
- step-and-repeat system
- step-and-repeat photomask system
- step-on-wafer projection system
- surface measurement system
- terminal point detection system
- thermal mapping system
- thick-film resistor system
- transfer system
- transport system
- tri-metal system
- trimming system
- turnkey CAD system
- UV exposure system
- vacuum-deposition system
- vacuum purge system
- variable-shaped electron-beam exposure system
- vector-scan e-beam system
- wafer gaging system
- wafer routing system
- wafer-scale system
- wafer-stepper projection system
- wave solder system
- wiring system
- X-ray exposure system -
7 technique
1) метод, спосіб (див. т-ж арproach, method) 2) технологія (див. т-ж technology) - alloying technique
- annular sawing technique
- assembly technique
- automatic layout technique
- automatic test generation technique
- BIMOS technique
- bond etchback technique
- boron etch stop technique
- bump-metallization technique
- CAD technique
- GDI technique
- chip floorplan technique
- chip processing technique
- circuit technique
- CMOS technique
- cold-crucible technique
- cold-processing technique
- collector-diffusion isolation technique
- commutating auto-zeroing technique
- computerized design technique
- CVD technique
- decomposition technique
- definition technique
- development advanced rate technique
- diffused planar technique
- diffusion technique
- double-diffusion technique
- dry processing technique
- electrochemical passivation technique
- electron-beam technique
- electroplating technique
- etch-and-refill technique
- etchback technique
- etch-stop technique
- evaporation technique
- fabrication technique
- film technique
- flip-chip technique
- floating crucible technique
- folding technique
- four-point probe technique
- growth technique
- implant-isolation technique
- incremental time technique
- integrated technique
- interconnection technique
- internal trace technique
- ion-implantation technique
- isolation technique
- laser selective photoionisation technique
- laser-trimming technique
- lifting technique
- lift-off technique
- light-scattering technique
- liquid encapsulation Czochralski technique
- liquid-phase epitaxy technique
- liquid epitaxy technique
- lithographic technique
- masked diffusion technique
- masking technique
- mask-making technique
- masterslice technique
- mesa-fabrication technique
- Minimod technique
- mixed-level technique
- mixed-mode technique
- modified horizontal Bridgman technique
- modified Bridgman technique
- molecular-beam epitaxy technique
- monolithic technique
- mounting technique
- multichip assembly technique
- multiwire technique
- native охide technique
- node tearing technique
- n-type doping technique
- open-tube diffusion technique
- open-tube technique
- optical alignment technique
- oxide masking technique
- oxygen-plasma охidation technique
- packaging technique
- peripheral sawing technique
- photolithographic technique
- photomasking technique
- photomechanical technique
- photoresist lift-off technique
- piecewise linear modeling technique
- planar-epitaxial technique
- plasma-охidation technique
- plasma-spraying technique
- p-n junction isolation technique
- positive photoresist masking technique
- probe technique
- processing technique
- production technique
- production soldering technique
- reduction technique
- resist technique
- SBC technique
- scaling technique
- screen-printing technique
- screen-stencil technique
- self-aligned double-diffusion technique
- serial-writing technique
- shallow V-groove technique
- shrinking technique
- silk-screeningtechnique
- silk-screentechnique
- single-layer interconnection technique
- single-level interconnection technique
- sinking technique
- slice technique
- solder reflow technique
- solute-diffusion technique
- SOS isolation technique
- sparse matrix technique
- staged-diffusion technique
- staining technique
- stencil technique
- step-and-repeat reduction technique
- tape-carrier technique
- test technique
- thermal wave technique
- trench-etch technique
- tri-mask technique
- trimming technique
- two-layer resist technique
- two-phase technique
- two-step technique
- vapor-oxidation technique
- vapor-phase epitaxial technique
- V-ATC technique
- wet technique
- wire-bonding technique
- wire-wrapping technique
- wire-wrap technique
- wiring technique
- 1:1 photomasking techniqueEnglish-Ukrainian dictionary of microelectronics > technique
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